新闻|2019年1月8日
世界上最大的OSAT提供商名称AP300™由于Veeco的行业领先的正常运行时间和流程性能，其首选的光刻系统
Plainview，纽约，2019年1月8日 - Veeco Instruments Inc.（NASDAQ：VECO）今天宣布，世界上最大的外包组装和测试（OSAT）提供商已购买了多个VEECO AP300™岩石学系统。AP300补充了OSAT先前安装的VEECO工具，根据其行业领先的正常运行时间和较低的总拥有成本（COO）选择了AP300。This purchase is illustrative of continued strong market demand for Veeco’s lithography systems, given the tools’ ability to handle next-generation advanced packaging process needs including copper (Cu) pillar, wafer-level packaging (WLP), fan-out WLP (FOWLP) and 3D integrated circuit developments.
The AP300 lithography stepper’s winning combination of overlay, resolution, sidewall profile performance and broadband flexibility enables highly automated, cost-effective manufacturing valued by foundries and OSATs for applications such as fan-in WLP, FOWLP, through-silicon via, silicon interposer solder and Cu pillar bumping. Given the strong market growth expected in mobile, IoT and artificial intelligence (AI) applications, OSATs seek to ensure they are competitively positioned to drive customer acquisition and retention. According to Yole, the equipment and materials market for FOWLP alone will expand at a compound annual growth rate (CAGR) of 43 percent to reach $694 million by 2021.
彼得·波尔斯内夫（Peter Pershnev）指出：“出行，物联网，人工智能和深度学习正在与全球大趋势的迈出强大的增长，所有这些都由3D集成和高级包装等技术启用。”of Veeco’s Ultratech business unit. “As we grow our customer base, Veeco’s experienced team of technologists continues to work closely with OSATs and foundries to deliver industry-leading innovations that directly address their performance, yield and CoO challenges.”
关于Veeco
Veeco（NASDAQ：VECO）是创新半导体工艺设备的领先制造商。我们经过验证的MOCVD，光刻，激光退火，离子束和单晶片蚀刻和清洁技术在生产用于固态照明和显示的LED中起着不可或缺的作用，以及制造高级半导体设备。凭借旨在最大化绩效，产量和所有权成本的设备，Veeco在所有这些服务市场中都持有技术领导地位。vwin官方网站要了解有关Veeco创新设备和服务的更多信息，请访问www.theljp.com。
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VEECO媒体联系人：David Pinto |408-325-6157 |dpinto@veeco.com