由于Veeco的行业领先的正常运行时间和流程性能，世界上最大的外包装配和测试提供商名称为AP300E™的首选光刻系统
Plainview，N.Y.，2018年11月06日（全球新闻中心） -Veeco Instruments Inc.（纳斯达克：Veco）今天宣布，世界上最大的外包装配和测试（Osat）提供商已经购买了多个Veeco AP300E光刻系统。补充Osat先前已安装的Veeco工具，AP300E是根据其卓越的正常运行时间选择的，较低的总体拥有成本（COO）和特殊性能。This purchase is illustrative of continued strong market demand for Veeco’s expanding portfolio of lithography systems, given the tools’ ability to handle next-generation advanced packaging process needs including copper (Cu) pillar, wafer-level packaging (WLP), fan-out WLP (FOWLP) and 3D integrated circuit developments.
The AP300E lithography stepper’s exceptional overlay, resolution, sidewall profile performance and broadband flexibility enable highly automated, cost-effective manufacturing valued by foundries and OSATs for applications such as fan-in WLP, FOWLP, through-silicon via, silicon interposer solder and Cu pillar bumping. Given the exponential market growth expected in mobile, IoT and artificial intelligence (AI) applications, OSATs seek to ensure they are competitively positioned to drive customer acquisition and retention. According toy单独的家禽的设备和材料市场将以43％的复合年增长率（CAGR）扩展，达到2021年的6.94亿美元。
“流动性，物联网，AI和深度学习的较大，看到了全球兆元的爆炸性增长，所有这些都是由3D集成和先进包装等技术支持的，”Peter Porshnev，Ph.D.，博士，高级副总裁兼总经理of Veeco’s Ultratech business unit. “As we grow our customer base, Veeco’s experienced team of technologists continues to work closely with OSATs and foundries to deliver industry-leading innovations that directly address their performance, yield and CoO challenges.”
关于Veeco.
Veeco（纳斯达克：Veco）是一家创新半导体工艺设备的领先制造商。我们经过验证的MOCVD，光刻，激光退火，离子束和单晶片蚀刻和清洁技术在生产用于固态照明和显示器的LED方面以及高级半导体器件的制造中起作用的积分作用。凭借旨在最大限度地提高业绩，产量和所有权成本的设备，Veeco在所有这些送达市场中占据了技术领导职位。vwin官方网站了解有关Veeco的创新设备和服务，请访问www.theljp.com.。
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